CB-13-1990

X-Ray Fluorescence for Measuring Plating Thickness

CB-13-1990 發布歷史

PURPOSE There are a number of techniques currently being used for measuring plating thickness. All have peculiar application and also limitations@ Basic economics@ however@ demands that for measuring gold thicknesses in the commonly used plating thickness ranges@ a system must be highly reliable@ accurate@ repeatable and fast. Over the past several years X-ray Fiuorescence systems@ more than any other@ have been found to meet that requirement. There are@ however@ many facets of operation involved with x-ray techniques with which the operator should be acquainted. The purpose of this paper is to highlight these subtleties so that x-ray users are aware of them and can implement procedures for their instrument operation which will provide measurements of highest possible levels of accuracy and repeatability.

CB-13-1990由ECIA - Electronic Components Industry Association 發布于 1990-01-01，并于 1999-12-28 實施。

CB-13-1990的歷代版本如下：

• 1990年01月01日 CB-13-1990

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標準號

CB-13-1990

發布日期

1990年01月01日

實施日期

1999年12月28日

廢止日期

無

中國標準分類號

/

國際標準分類號

/

發布單位

ECIA - Electronic Components Industry Association

引用標準

8

適用范圍

PURPOSE There are a number of techniques currently being used for measuring plating thickness. All have peculiar application and also limitations@ Basic economics@ however@ demands that for measuring gold thicknesses in the commonly used plating thickness ranges@ a system must be highly reliable@ accurate@ repeatable and fast. Over the past several years X-ray Fiuorescence systems@ more than any other@ have been found to meet that requirement. There are@ however@ many facets of operation involved with x-ray techniques with which the operator should be acquainted. The purpose of this paper is to highlight these subtleties so that x-ray users are aware of them and can implement procedures for their instrument operation which will provide measurements of highest possible levels of accuracy and repeatability.