This specification applies to single, dual and triple chamber temperature cycling and covers
component and solder interconnection testing. In single chamber cycling, the load is placed in a
stationary chamber, and is heated or cooled by introducing hot or cold air into the chamber. In
dual chamber cycling, the load is placed on a moving platform that shuttles between stationary
chambers maintained at fixed temperatures. In triple chamber temperature cycling there are
three chambers and the load is moved between them.